Emerson 1410 Instrukcja Obsługi Strona 97
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Configuring and Operating the System
AXP 1410 Installation and Use (6806800H70D)
97
BP_B_DHCP_SERVER=
z Backplane Bonding Mode
The backplane interfaces can be a part of a bonding interface if the BP_BOND_MODE
variable is set to either dhcp or static. The bonding interface is named bond0.
Use the following parameters to the BP_BOND_MODE variable to define the configuration
for backplane bonding mode.
none - Do not configure the bonding interface (default)
dhcp - Obtain an IP address for the interface via DHCP
static - Use other parameters to configure the interface
BP_BOND_MODE=none
— Static Configuration of the Backplane Bonding Interface
If using the static parameter to configure the backplane bonding interface, specify
the desired IP address and netmask using the following variables:
BP_BOND_IPADDR=
BP_BOND_NETMASK=
z Default Route (Gateway)
A default route can be configured using the GATEWAY_MODE variable.
Use the following parameters to the GATEWAY_MODE variable to define the configuration
for the route.
none - Do not configure the default route
auto - Automatic configuration of the router
static - Use other parameters to configure the router
GATEWAY_MODE=auto
— Static Configuration of the Default Route
If using the static parameter to configure the default route, specify the desired
router IP address using the following variable:
- AXP 1410 1
- Trademarks 2
- Contact Address 2
- Contents 3
- List of Tables 10
- List of Figures 13
- About this Manual 15
- Abbreviations 16
- Conventions 19
- Summary of Changes 20
- Comments and Suggestions 21
- System Overview 23
- 1.1.1 Shelf 26
- 1.1.2 Backplane 26
- 1.1.3 Shelf Manager 26
- 1.1.4 Blades 27
- 1.1.5 Hub Slots 28
- 1.1.6 Rear Transition Modules 28
- 1.1.7 Power Entry Modules 28
- 1.1.8 Fan Tray Modules 28
- 1.2 Standard Compliances 29
- 1.3 Ordering Information 30
- 1.4 Product Identification 32
- Site Preparation 35
- 2.3 Requirements 37
- 2.3.2 Power Requirements 39
- 2.4 Dimensions and Weight 40
- 2.5 Mounting Options 41
- 2.6 Cooling Considerations 42
- 2.7 Acoustic Noise Control 44
- 3.3 Installation 46
- 3.3.2 Connecting the Cables 51
- 3.3.2.1 DC Power Cable 52
- 3.3.3 Grounding the System 56
- 3.3.4 Powering Up the System 57
- 3.4 Powering Down the System 58
- 3.5 Emergency Power Off 58
- FRU Installation 61
- 4.2.1 Installing the Board 63
- 4.2.2 Removing the Board 64
- 4.3.1 Tools You Will Need 65
- 4.3.2 Removing the PEM 65
- 4.3.3 Installing the PEM 68
- 4.4.1 Removing the Upper FTM 73
- 4.4.3 Removing the Lower FTM 74
- 4.5 Installing a Fan Filter 75
- Chapter 5 79
- 5.1 Overview 79
- 5.2 Network Management 79
- ATCA Hub 82
- Blade #1 82
- Blade #n 82
- # hpishaddr -b "07" 85
- 5.2.4 IP Addresses 86
- SAM1410-1 87
- SAM1410-2 87
- 5.2.4.1 Out-of-Band Interface 88
- 5.2.4.2 Backplane Interfaces 91
- 5.2.4.3 Configuration File 94
- 5.4 Software 100
- 5.4.2 Upgrade 101
- 5.5 Power Entry Module (PEM) 102
- 5.5.2 IPMC Circuitry 103
- 5.6 Fan Tray Modules 104
- 5.6.2 Cooling Budget 105
- 5.7 Redundancy 106
- 5.7.1.1 Heartbeat 107
- 5.7.1.2 Data Replication 107
- 5.7.1.3 HPI Interface 107
- 5.7.2.1 Shelf Manager 108
- 5.7.2.2 Hub Blade 109
- 5.7.2.3 System Manager 109
- Figure 5-5 System Start-Up 110
- 5.7.3 Redundancy Operations 111
- Supported IPMI Commands 119
- 6.2.3 Sensor Device Commands 120
- 6.2.4 FRU Device Commands 120
- 6.3 PICMG 3.0 Commands 121
- Chapter 7 123
- 7.1 Introduction 123
- 7.2.2.1 Voltage Sensors 125
- Table 7-4 Sensor No. 5 +3.3V 127
- 7.2.2.2 Temperature Sensors 129
- 7.2.2.3 Fan Speed Sensors 133
- Table 7-14 Sensor No. 9 Fan 2 134
- 7.2.3.1 Hot Swap Sensor 143
- 7.2.3.2 IPMB Link Sensor 143
- 7.2.3.3 Reserved Sensor 144
- 7.2.3.4 OEM-Reserved Sensors 145
- 7.3.1 PEM FRU Information 152
- 7.3.2 E-Keying 153
- 7.3.3 Power Configuration 154
- Voltage Sensors 155
- Current Sensors 155
- Temperature Sensor 155
- 7.3.5.1 Voltage Sensors 156
- 7.3.5.2 Current Sensors 161
- 7.3.5.3 Temperature Sensor 162
- 7.3.6.1 Hot Swap Sensor 163
- 7.3.6.2 IPMB Link Sensor 164
- Table 7-51 Sensor No. 5, CB 1 165
- Table 7-52 Sensor No. 6 CB 2 166
- Table 7-53 Sensor No. 7 CB 3 167
- Table 7-54 Sensor No. 8 CB 4 167
- Table 7-55 Sensor No. 9 CB 5 168
- Shelf Management Alarm Module 171
- 8.2 Features 172
- 8.4 Functional Description 176
- 8.4.3 Master-Only I 177
- 8.4.4 Shelf FRU SEEPROM 177
- 8.4.5 SAM LEDs 178
- 8.5 Management and Control 179
- 8.5.1.1 Voltage Sensors 180
- 8.5.1.3 Fan Speed and Control 180
- 8.5.2 Redundancy Control 183
- 8.5.2.2 HRI Protocol 184
- 8.5.2.3 Ethernet Signals 185
- 8.6 Telco Alarm Functionality 186
- 8.6.2 Telco Alarm LEDs 187
- 8.6.3 Telco Alarm Interface 187
- 8.7 Hot Swap Interface 188
- 8.8 Power 188
- 8.9 SAM Software 188
- 8.9.1 imls Utility 189
- Related Documentation 191
- A.2 Related Specifications 192
- Safety Notes 193
- Operation 195
- Grounding 197
- Connectors and Cabling 199
- Expansion and FRU Exchange 200
- Environment 203
- Sicherheitshinweise 205
- System Installation 206
- Stecker und Verkabelung 211
- Umweltschutz 215
- , 180, 188 219
- © 2009 Emerson Electric Co 222
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